UTCP: A Novel Polyimide-Based Ultra-Thin Chip Packaging Technology

Autor:	Wim Christiaens, Jan Vanfleteren, Erwin Bosman
Rok vydání:	2010
Předmět:	Interconnection Materials science Packaging engineering business.industry Nanotechnology Chip Electronic Optical and Magnetic Materials Chip-scale package Hardware_INTEGRATEDCIRCUITS FLEX Integrated circuit packaging Electrical and Electronic Engineering business Polyimide
Zdroj:	IEEE Transactions on Components and Packaging Technologies. 33:754-760
ISSN:	1557-9972 1521-3331
DOI:	10.1109/tcapt.2010.2060198
Popis:	Flexible materials, today, are being used already as base substrates for electronic assembly. A lot of mounted components could be integrated in flexible polyimide (PI) substrates. Very interesting advantages of integrating components into the flex are compactness and enhanced flexibility; not only the interconnection but also the components themselves can be mechanically flexible. This paper describes a PI-based embedding technology for integrating very thin silicon chips in between two spin-on PI layers, the ultra-thin chip package (UTCP). This paper discusses the different process steps in the UTCP production and also presents the interconnection test results realized with this technology.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8104e01eed5a9cd200826fab81ac607d https://doi.org/10.1109/tcapt.2010.2060198 Zobrazit plný text záznamu