Evaluation of the Electromigration Performance of New Aluminium Via Plug-Fill Techniques for 0.25μm and 0.18μm Technologies

Autor:	S. Foley, A. Mathewson, C. Gounelle, N. Chan Tung, S. Louwers, G. Wyborn
Rok vydání:	1998
Předmět:	Materials science chemistry law Aluminium Metallurgy chemistry.chemical_element Stress conditions Spark plug Electromigration law.invention
Zdroj:	MRS Proceedings. 516
ISSN:	1946-4274 0272-9172
DOI:	10.1557/proc-516-305
Popis:	The electromigration performance of samples fabricated with new Al via-filling techniques are studied and compared. The new techniques are (1) Hot Al mono-chamber and (2) CVD/PVD Al. Their electromigration performances are assessed over a range of stress conditions and compared with that of a standard W- etchback technique.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::808cb42e2ae3e09b497291a2240a06c7 https://doi.org/10.1557/proc-516-305 Zobrazit plný text záznamu Full text from SpringerLink