Effect of Corrosion on Mechanical Reliability of Sn-Ag Flip-Chip Solder Joint
| Autor: | Sang Su Ha, Gun Rae Kim, Haebum Lee, Han-Byul Kang, Sangwoo Pae |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Materials science Mechanical Engineering 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Corrosion Mechanics of Materials Soldering 0103 physical sciences Forensic engineering General Materials Science Composite material 0210 nano-technology Joint (geology) Mechanical reliability Flip chip |
| Zdroj: | MATERIALS TRANSACTIONS. 57:1966-1971 |
| ISSN: | 1347-5320 1345-9678 |
| DOI: | 10.2320/matertrans.m2016203 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|