Packaging of PIN Photodiode on Patch Antenna for a Dual-Mode Indoor RF/FSO Receiver
| Autor: | Ali Mirvakili, Valencia M. Joyner, Jun Liao, Anatoliy Boryssenko, Z.R. Huang |
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| Rok vydání: | 2011 |
| Předmět: |
Patch antenna
Transimpedance amplifier Engineering HFSS business.industry Optical link Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials Photodiode law.invention Microstrip antenna law Electronic engineering Radio frequency Electrical and Electronic Engineering business Free-space optical communication |
| Zdroj: | IEEE Transactions on Components, Packaging and Manufacturing Technology. 1:335-343 |
| ISSN: | 2156-3985 2156-3950 |
| DOI: | 10.1109/tcpmt.2010.2101730 |
| Popis: | This paper reports the design, packaging and characterization of a miniaturized dual-mode radio-frequency (RF)/free space optical (FSO) indoor wireless receiver module. Two different patch antennas are designed and integrated with bare die photodiodes together with transimpedance amplifier (TIA) circuits on a printed circuit board (PCB). Ansoft HFSS is used to predict the coupling from RF to FSO link. Measurement results verify that optical link degradation is minimized with the specially designed patch structure. FSO link operation at 2 Gb/s in a 10 GHz RF environment is achieved. Through the comparison to previously developed RF/FSO modules, the new receiver boards demonstrate reduced RF-to-optical cross channel coupling, and increased gain and antenna radiation efficiency. |
| Databáze: | OpenAIRE |
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