Inhibiting the growth of Cu3Sn and Kirkendall voids in the Cu/Sn-Ag-Cu system by minor Pd alloying

Autor:	Cheng-En Ho, Wei Hsiang Wu, Tsai Tung Kuo, Chun Chien Wang
Rok vydání:	2012
Předmět:	Microscope Materials science Kirkendall effect Scanning electron microscope Alloy Metallurgy Electron microprobe engineering.material Focused ion beam Electronic Optical and Magnetic Materials law.invention Transmission electron microscopy law Soldering engineering Composite material
Zdroj:	Electronic Materials Letters. 8:495-501
ISSN:	2093-6788 1738-8090
DOI:	10.1007/s13391-012-2049-3
Popis:	In this study, the metallurgical reaction between Cu substrates (electrolytic type) and a Sn3Ag0.5Cu-xPd alloy at 180°C was examined using a scanning electron microscope (SEM), electron probe microanalyzer (EPMA), focused ion beam (FIB) microscope, and transmission electron microscope (TEM). The results showed that the growth of Cu3Sn in the Cu/Sn-Ag-Cu solder joints was substantially suppressed by doping with a minor quantity of Pd (0.1–0.7 wt. %) in the solder alloy. The sluggish growth of Cu3Sn reduced the formation of Kirkendall voids at the Cu/Cu3Sn interface and significantly improved the mechanical reliability of the joint interface. It was argued that a minor addition of Pd into the solder stabilized the Cu6Sn5 phase and enlarged the interdiffusion coefficient of Cu6Sn5 but diminished that of the neighboring phase (Cu3Sn), thereby decreasing the Kirkendall effect in the Cu/Sn-Ag-Cu reactive system.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7fc930b71fe18cf6e20297caf5dabf96 https://doi.org/10.1007/s13391-012-2049-3 Zobrazit plný text záznamu Full text from SpringerLink