Planarized aluminum metallization for sub-0.5 mu m CMOS technology

Autor:	Y.S. Lin, C. C. Wei, R. Sundaresan, F. S. Chen, F.T. Liou, G.A. Dixit
Rok vydání:	2002
Předmět:	Materials science business.industry Electrical engineering Process (computing) chemistry.chemical_element Integrated circuit law.invention Characterization (materials science) CMOS chemistry Sputtering law Aluminium Optoelectronics business
Zdroj:	International Technical Digest on Electron Devices.
DOI:	10.1109/iedm.1990.237228
Popis:	The authors describe an aluminum sputter process, called the Al-plug process, which results in complete filling of submicron contacts and vias of various sizes. The process can be done in a conventional sputtering system. Material and electrical characterization of the film and the implementation of this process in submicron integrated circuits are presented. >
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7fc6536fdc70cfb48275f6248d422a53 https://doi.org/10.1109/iedm.1990.237228 Zobrazit plný text záznamu