A Study on Through-Silicon-via Using Tri-Block Copolymer and Pulse Electroplating
| Autor: | Suh Su‐Jeong, Son Hwa‐Jin, Kim Tae‐Yoo |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
Materials science
Through-silicon via Metallurgy Biomedical Engineering Bioengineering 02 engineering and technology General Chemistry 021001 nanoscience & nanotechnology Condensed Matter Physics Pulse electroplating 0202 electrical engineering electronic engineering information engineering Copolymer 020201 artificial intelligence & image processing General Materials Science Composite material 0210 nano-technology |
| Zdroj: | Journal of Nanoscience and Nanotechnology. 16:8396-8401 |
| ISSN: | 1533-4880 |
| DOI: | 10.1166/jnn.2016.12485 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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