Liquid/Solid Interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu Dissimilar Joints during Soldering at Low Temperature by In-Situ Synchrotron Imaging

Autor:	M. I. I. Ramli, M. A. A. Mohd Salleh, T. Nishimura, H. Yasuda, N. S. Mohamad Zaimi, K. Nogita
Rok vydání:	2022
Předmět:	General Engineering General Materials Science
Zdroj:	JOM. 74:2760-2769
ISSN:	1543-1851 1047-4838
DOI:	10.1007/s11837-022-05229-9
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7f39bdc22b8978d6fdb10dc1cfd259e2 https://doi.org/10.1007/s11837-022-05229-9 Full text from SpringerLink