Highly Productive Solder Interconnect Formation by Bump Stabbing for 3D-TSV Die Stacking
| Autor: | Fukuzumi Shizu, Naoya Suzuki, Hitoshi Onozeki, Toshihisa Nonaka |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Materials science Pillar Stacking 02 engineering and technology 021001 nanoscience & nanotechnology 01 natural sciences Die (integrated circuit) Stress (mechanics) Soldering 0103 physical sciences Solder interconnect Composite material 0210 nano-technology Joint (geology) Layer (electronics) |
| Zdroj: | 2018 IEEE 68th Electronic Components and Technology Conference (ECTC). |
| DOI: | 10.1109/ectc.2018.00235 |
| Popis: | New high speed die stacking process using the originally designed stabbing pad combined with mass reflow for 2.5D and 3D has been developed. The top die having the bump of Cu pillar and solder cap was picked and placed on the bottom die which has the stabbing pad. The bump was stabbed by the pad with aligned. The stabbing pad has columns of 3 to 4 µm height, which were plated Cu coated by Ni/Au. The stabbing step took only 0.1 second. Well wetted solder joint between the bump the stabbing pad was formed. Sn-Ni-Cu alloy layer was detected by cross sectional EDX analysis at the interface of the column and the solder. Numerical analysis by finite element method revealed that the advantage of the bump stabbing process of the lower stress around the joint during reflow process comparing with TCB. The estimated UPH is 1440, which is much higher than that of conventional TCB process. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|