Mark Damage Phenomenon Caused by Superimposed CMP Dishing on Large-Area STI Regions

Autor:	Xu WenSheng, Ba You, Chen YongBo, Zhu YuJie, Li RunLing, Ding ShiJin, Ye JiongHan
Rok vydání:	2022
Zdroj:	2022 China Semiconductor Technology International Conference (CSTIC).
DOI:	10.1109/cstic55103.2022.9856832
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7f28a8cd9a8f096c2fbdc0d540bb79b2 https://doi.org/10.1109/cstic55103.2022.9856832 Zobrazit plný text záznamu