Time evolution of strain distribution during ultrasonic bonding of Cu wire: Impact of bonding temperature
| Autor: | Tanemasa Asano, Kenichi Nakadozono, Keiichiro Iwanabe, Mamoru Sakamoto |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Wire bonding Materials science 020208 electrical & electronic engineering Time evolution 02 engineering and technology Ultrasonic bonding 01 natural sciences Temperature measurement Piezoresistive effect 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Perpendicular Ultrasonic sensor Composite material Strain gauge |
| Zdroj: | 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition. |
| Popis: | Impact of bonding temperature on bonding dynamics in the ultrasonic bonding of Cu FAB (free air ball) is investigated by measuring dynamic strain with piezoresistive strain sensor. The strain sensor was composed of an array of pairs of n-and p-type strain gauges to determine the strains along two axes, the axis of ultrasonic motion and the axis perpendicular to the surface of the substrate. Au wire bonding was also investigated for comparison. The substrate temperature was changed from room temperature to 150°C. It is clearly observed that deformation of FAB is accelerated by elevating the substrate temperature. Most of the deformation of FAB is found to be completed within several milliseconds after the start of the bonding operation. For the case of Au FAB bonding, significant reduction of residual strain was observed at 150°C. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|