Low-temperature rough-surface wafer bonding with aluminum nitride ceramics implemented by capillary and oxidation actions

Autor:	Shao-Ming Nien, Jian-Long Ruan, Yang-Kuao Kuo, Benjamin Tien-Hsi Lee
Rok vydání:	2022
Předmět:	Process Chemistry and Technology Materials Chemistry Ceramics and Composites Surfaces Coatings and Films Electronic Optical and Magnetic Materials
Zdroj:	Ceramics International. 48:8766-8772
ISSN:	0272-8842
DOI:	10.1016/j.ceramint.2022.01.131
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7eda82d9cedf305672502d6cabcf75db https://doi.org/10.1016/j.ceramint.2022.01.131 Zobrazit plný text záznamu Full Text from ScienceDirect