| Autor: |
P.j. Anthony, K.P. Fennessy, M.A. Occhionero, K.W. Davido, E.Y. Chan, Chiu-Chao Chen, M. Rassaian, L.T. Gomez, D.G. Koshinz, G.E. Henein, John Vanatta Gates, H.E. Hager, H.P. Soares, Joseph Shmulovich, R.L. St. Pierre, M. Cappuzzo, M.W. Beranek, Chi-Shain Hong |
| Rok vydání: |
2000 |
| Předmět: |
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| Zdroj: |
IEEE Transactions on Advanced Packaging. 23:461-469 |
| ISSN: |
1521-3323 |
| DOI: |
10.1109/6040.861561 |
| Popis: |
Under the DARPA sponsored Avionics Optoelectronic Module Technology program, new passive alignment carrier (PAC) optical subassemblies (LED-PAC and PIN-PAC) ruggedized for military/aerospace avionics fiber-optic transmitter and receiver applications have been developed, LED-PAC and PIN-PAC silicon micro-optical bench substrates were fabricated together on a 5 in diameter silicon wafer via multistage photolithography, thin-film, and substrate processing. Alignment v-grooves designed for passive optical alignment of 100/140 /spl mu/m multimode optical fiber to the optoelectronic devices were terminated by solder locking the fiber to the silicon PAC substrates. The LED-PAC comprising a surface emitting LED die-bonded onto a novel precision molded AM submount passively mounted onto the silicon microbench achieves the required high coupling efficiency to 100/140 /spl mu/m multimode optical fiber to meet stringent avionics transmitter output power requirements. The 100/130 /spl mu/m multimode optical fiber-pigtailed PIN-PAC with a refractive lens etched into the p-i-n photodiode backside surface exhibited responsivities greater than 0.8 A/W at 1.3 /spl mu/m wavelength. The LED-PAC and PIN-PAC optical subassemblies integrated with Boeing ARINC 636 (FDDI) transmitter and receiver thick film multichip (MCM-C) circuitry are capable of meeting both ARINC 636 and FDDI physical layer requirements. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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