Autor: |
R. S. Williams, Joo Yong Sim, B. Dura, D. A. Wickeraad, Matthew A. Hopcroft, C. L. Roozeboom, Peter G. Hartwell, W. S. Smith, Beth L. Pruitt |
Rok vydání: |
2012 |
Předmět: |
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Zdroj: |
2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS). |
DOI: |
10.1109/memsys.2012.6170114 |
Popis: |
We present multi-functional integrated sensors for the environment (MFISEs) combining ten sensor functions on a single silicon die. The purpose of the MFISEs chip is to monitor important environmental parameters such as temperature, humidity and air speed, along with acceleration in three axes. Through a common fabrication process and integrated sensor design, the ten sensing functions required only five photolithography mask steps. To our knowledge, MFISEs demonstrates the highest degree of sensor fusion on a single die. Sensor integration is a key enabler of new applications in mobile electronics and wireless sensor networks, and the potential to use MFISEs for ten sensing functions provides significant cost, size, and power savings over ten individual devices. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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