Numerical simulation of the interfacial stress between epoxy resin and metal conductor of power equipment during epoxy curing

Autor:	Chuang Wang, Gang Zhou, Qing Sun, Chi Chen, Zaiqin Zhang, Hui Li, ZongRen Peng
Rok vydání:	2022
Předmět:	Energy Engineering and Power Technology Electrical and Electronic Engineering
Zdroj:	High Voltage. 7:903-915
ISSN:	2397-7264
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7e0af8d9f8bd9964c6d4d7d27a2b0f6d https://doi.org/10.1049/hve2.12206 Zobrazit plný text záznamu Plný text