Influence of Low Thermal Budget Plasma Oxidation and Millisecond Laser Anneal on Gate Stack Reliability in view of 3D Sequential Integration

Autor:	H. Graoui, C. Guedj, R. Gassilloud, Cédric Leroux, C.-M. V. Lu, S. Sharma, M.-P. Samson, T. Skotnicki, R. Kies, Perrine Batude, N. Rambal, Bernard Previtali, C. Fenouillet-Beranger, L. Brunet, A. Toffoli, Sebastien Kerdiles, Xavier Garros, D. Larmagnac, G. Romano, M. Vinet, N. Bernier
Rok vydání:	2016
Předmět:	Millisecond Reliability (semiconductor) Materials science business.industry law Thermal Gate stack Optoelectronics Plasma business Laser law.invention
Zdroj:	Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials.
DOI:	10.7567/ssdm.2016.ps-1-06
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7debe69b75310f0567b3b14bfc4c42fb https://doi.org/10.7567/ssdm.2016.ps-1-06 Zobrazit plný text záznamu