Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling
| Autor: | Baris Sabuncuoglu, Geert Willems, Filip Vanhee, Dirk Vandepitte, Bart Vandevelde |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Materials science business.industry 02 engineering and technology Structural engineering Bending 021001 nanoscience & nanotechnology 01 natural sciences Industrial and Manufacturing Engineering Finite element method Electronic Optical and Magnetic Materials Dwell time Creep Chip-scale package Soldering 0103 physical sciences Electrical and Electronic Engineering 0210 nano-technology business Joint (geology) Parametric statistics |
| Zdroj: | IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1957-1964 |
| ISSN: | 2156-3985 2156-3950 |
| DOI: | 10.1109/tcpmt.2017.2739808 |
| Popis: | Fatigue performance of solder joints in four-point bending test is evaluated by finite-element modeling. A simplified modeling technique is implemented in order to focus on the behavior of the critical solder joint. The fatigue life is estimated by taking into account the creep behavior of the solder joints and the utilization of Morrow’s fatigue model. Fatigue life curves are generated for room temperature and two elevated temperatures with the critical orientation of chip scale packages on the test board. The results are compared with the real four-point bending test conducted for two different temperatures. In addition, some parametric studies are conducted including the significance of test temperature, copper wiring structure, and the dwell time in the cyclic loading profile. Besides these, the structural integrity of the test board is also checked. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|