| Autor: |
Verena Hein, Marco Erstling |
| Rok vydání: |
2016 |
| Předmět: |
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| Zdroj: |
2016 Pan Pacific Microelectronics Symposium (Pan Pacific). |
| DOI: |
10.1109/panpacific.2016.7428412 |
| Popis: |
Monitoring Wafer Level Reliability (WLR) tests are common to guarantee process stability and homogeneity. The test cost and test time efficiency are very important because of the high number of monitoring tests. Interconnects like metal lines and via structures are typically tested by higher temperatures on a thermo chuck because the possibilities for test acceleration are limited by Joule heating. Process Control Monitor (PCM) test systems with thermo chucks are more expensive and the time to reach stable chuck temperature extends the test time in addition. Typically poly silicon heaters are in use [1] but applications for interconnect test structures are limited. Interconnect layers could be far away from poly silicon in the metal stack. Self-heater structures have to be designed carefully because the additional metal environment could influence the mechanical properties of the test line as well as the lifetime [2]. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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