Simulation of thermally induced package effects with regard to piezoresistive pressure sensors
| Autor: | Dieter Arand, Frank Schilling, Kurt Weiblen, Werner Langheinrich |
|---|---|
| Rok vydání: | 1997 |
| Předmět: |
Materials science
business.industry Metals and Alloys Electrical engineering Mechanical engineering Condensed Matter Physics Pressure sensor Finite element method Surfaces Coatings and Films Electronic Optical and Magnetic Materials Microsystem Electrical and Electronic Engineering business Instrumentation Piezoresistive pressure sensors |
| Zdroj: | Sensors and Actuators A: Physical. 60:37-39 |
| ISSN: | 0924-4247 |
| DOI: | 10.1016/s0924-4247(96)01419-7 |
| Popis: | Microsystems are on their way out of laboratories into production. One of these microsystems, a piezoresistive pressure sensor developed by Robert Bosch GmbH, is examined within this paper. Obviously, one can detect undesirable temperature effects resulting from the sensor package, which influence the electrical characteristics of the sensor. By means of finite-element modelling (FEM), a simulation of the temperature effects can be managed. It is also possible to search for alternative designs of the sensor package. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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