Vibration damping in chemical mechanical polishing system

Autor: Shijian Li, Hung Chih Chen, John M. White, Ramin Emami, Fred C. Redeker
Rok vydání: 2008
Předmět:
Zdroj: The Journal of the Acoustical Society of America. 124:703
ISSN: 0001-4966
DOI: 10.1121/1.2969612
Popis: A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retaining structure and the surface define a cavity for receiving the substrate. The retaining structure includes an upper portion in contact with the base, a lower portion, and a vibration damper separating the upper portion and the lower portion. The vibration damper, the vibration damper includes a material that does not rebound to its original shape when subjected to a deformation.
Databáze: OpenAIRE