Capacitively Coupled Non-Contact Probing Circuits for Membrane-Based Wafer-Level Simultaneous Testing

Autor:	Mutsuo Daito, Makoto Takamiya, Yoshio Komoto, Gil Su Kim, H. Gomyo, Yoshiro Nakata, Takayasu Sakurai, Katsuyuki Ikeuchi, Satoshi Sasaki, Kunihiko Iizuka, Hideki Kusamitsu
Rok vydání:	2011
Předmět:	Capacitive coupling Engineering business.industry Low-pass filter Interface (computing) Transistor Electrical engineering Chip law.invention law Wafer Electrical and Electronic Engineering business Probe card Electronic circuit
Zdroj:	ISSCC
ISSN:	1558-173X 0018-9200
DOI:	10.1109/jssc.2011.2160790
Popis:	Wafer-level simultaneous testing (WLST) where all chips on a wafer are tested and burned in at the same time is preferable in reducing the cost of obtaining Known Good Dies (KGD's). At present, however, it is difficult to realize the WLST because it requires a probe card with some hundred thousand needles, leading to more than a ton of force needed for stable contact of all needles. Non-contact probing has been proposed based on a chip-to-chip inductively-coupled interface [1] which can reduce the force but it needs a probing chip built specific to a certain product, which is costly. Recently, a low-cost membrane-based probing technique has been disclosed which makes use of the atmospheric pressure and 700kg of force can be uniformly distributed over a 300mm wafer [2]. Yet, since a contacting bump is used and each bump requires 4g of force, the number of pins is limited to about 150K, which is still the world biggest pin counts ever reported.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7c509a33f42e7c890243bb1a76e84595 https://doi.org/10.1109/jssc.2011.2160790 Zobrazit plný text záznamu