An industrial feedback on the use of OPC UA for the vertical integration of semiconductor front-ends

Autor:	Fahad Rafique Golra, Marc Engel
Rok vydání:	2021
Předmět:	Semiconductor business.industry Mechanical engineering business Vertical integration Geology Front (military)
Zdroj:	2021 26th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA ).
DOI:	10.1109/etfa45728.2021.9613384
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7c22ceb2e4d8443d23f8e618ef016eb8 https://doi.org/10.1109/etfa45728.2021.9613384 Zobrazit plný text záznamu