Chemical Vapour Deposition of Silicon Dioxide Films in the OMTS-ozone-oxigen system
Jazyk: | ruština |
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Rok vydání: | 2021 |
Předmět: | |
DOI: | 10.18720/spbpu/3/2021/vr/vr21-2963 |
Popis: | Рданной ÑабоÑе ÑаÑÑмоÑÑено полÑÑение ÑÐ¾Ð½ÐºÐ¸Ñ Ñлоев диокÑида кÑÐµÐ¼Ð½Ð¸Ñ Ð¼ÐµÑодом Ñ Ð¸Ð¼Ð¸ÑеÑкого оÑÐ°Ð¶Ð´ÐµÐ½Ð¸Ñ Ð¸Ð· газовой ÑазÑ. ÐÑоведена ÑеÑÐ¸Ñ ÑкÑпеÑименÑов по полÑÑÐµÐ½Ð¸Ñ Ð¿Ð»ÐµÐ½Ð¾Ðº диокÑида кÑÐµÐ¼Ð½Ð¸Ñ Ð¿Ñи ÑазлиÑнÑÑ Ð¿Ð°ÑамеÑÑÐ°Ñ Ð¾ÑаждениÑ. ÐÑÑÐ»ÐµÐ´Ð¾Ð²Ð°Ð½Ñ ÑвойÑÑва оÑажденнÑÑ Ñлоев, а Ñакже влиÑние ÑемпеÑаÑÑÑÑ Ð¸ Ð´Ð°Ð²Ð»ÐµÐ½Ð¸Ñ Ð½Ð° ÑкоÑоÑÑÑ ÑоÑÑа и Ñ Ð°ÑакÑеÑиÑÑики полÑÑеннÑÑ Ð¿Ð»ÐµÐ½Ð¾Ðº. In this work, the preparation of thin layers of silicon dioxide by chemical vapor deposition is considered. A series of experiments was carried out to obtain silicon dioxide films at various deposition parameters. The properties of the deposited layers, as well as the effect of temperature and pressure on the growth rate and characteristics of the obtained films, are investigated. |
Databáze: | OpenAIRE |
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