CMUT-in-CMOS ultrasonic transducer arrays with on-chip electronics

Autor:	J.B. Fowlkes, David F. Lemmerhirt, Xiaoyang Cheng, Man Zhang, Oliver D. Kripfgans, Collin A. Rich, C. Yang
Rok vydání:	2009
Předmět:	Engineering Capacitive micromachined ultrasonic transducers Transducer CMOS business.industry Hardware_INTEGRATEDCIRCUITS Electronic engineering Ultrasonic sensor Electronics business Multiplexer Signal conditioning Electronic circuit
Zdroj:	TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.
Popis:	Integration of a 2D ultrasound transducer array with front-end signal conditioning electronics poses significant fabrication and packaging challenges due to the required number of elements and small element pitch. In this paper, we demonstrate a CMUT-in-CMOS approach that produces ultrasonic transducers and circuits on a single chip using a standard foundry CMOS process, augmented only with two blanket post-process steps for sacrificial etching and cavity sealing. 2D arrays as large as 16×16, with integrated on-chip buffers, switches and multiplexers were fabricated and successfully characterized. This approach provides a straightforward path to commercially viable 2D arrays for 3D medical imaging.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7bca9fd847c6718d4bd9027c63216d92 https://doi.org/10.1109/sensor.2009.5285878 Zobrazit plný text záznamu