Determination of deformations in PCB using tensometric stamps

Autor: I. H. Baciu
Rok vydání: 2019
Předmět:
Zdroj: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME).
DOI: 10.1109/siitme47687.2019.8990855
Popis: When I made a study on the structural deformation of a building's steel, I came up with the idea of using this method also for the deformations that can occur in printed wiring. In the case of buildings, it was the action of an external force applied to that structure and affecting different parts of that structure. In the case of the printed wiring, these external forces may also act to modify the shape of the PCB by modifying its flatness to tear. The problem that arises is related to the positioning of the sensor. The sensor used is 120-ohm resistive tensometric stamps, and the method of measuring and determining the action of a force I will describing in this paper.
Databáze: OpenAIRE