Excellent Improvement of Contact Resistivity and Thermal Stability for High Temperature Process after Silicidation of TiSi2 through Ta Interlayer for diffusion barrier

Autor: Min-Su Kim, Seong-Hyun Hwang, Seung-Hwan Kim, Jong-Hyun Kim, Euyjin Park, Kyu-Hyun Han, Hyun-Yong Yu
Rok vydání: 2023
Předmět:
Zdroj: IEEE Electron Device Letters. :1-1
ISSN: 1558-0563
0741-3106
Databáze: OpenAIRE