Excellent Improvement of Contact Resistivity and Thermal Stability for High Temperature Process after Silicidation of TiSi2 through Ta Interlayer for diffusion barrier
Autor: | Min-Su Kim, Seong-Hyun Hwang, Seung-Hwan Kim, Jong-Hyun Kim, Euyjin Park, Kyu-Hyun Han, Hyun-Yong Yu |
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Rok vydání: | 2023 |
Předmět: | |
Zdroj: | IEEE Electron Device Letters. :1-1 |
ISSN: | 1558-0563 0741-3106 |
Databáze: | OpenAIRE |
Externí odkaz: |