Package Technology Trend (Migration from Wirebonding to RDL Technology)

Autor:	Harufumi Kobayashi
Rok vydání:	2018
Předmět:	Wire bonding Engineering business.industry Electrical and Electronic Engineering business Reliability engineering
Zdroj:	Journal of The Japan Institute of Electronics Packaging. 21:386-396
ISSN:	1884-121X 1343-9677
DOI:	10.5104/jiep.21.386
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7b0ae8d27d24ba51a953acdd2709d954 https://doi.org/10.5104/jiep.21.386 Zobrazit plný text záznamu