Ultra thick epoxy-based dry-film resist for high aspect ratios
| Autor: | Anja Voigt, Holger Reinecke, N. Wangler, S. Beck, Claas Müller, G. Ahrens, Gabi Grützner |
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| Rok vydání: | 2012 |
| Předmět: |
chemistry.chemical_classification
Fabrication Materials science Epoxy Polymer Photoresist Condensed Matter Physics Aspect ratio (image) Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention chemistry Resist law visual_art Lamination visual_art.visual_art_medium Electrical and Electronic Engineering Composite material Electroplating |
| Zdroj: | Microelectronic Engineering. 97:92-95 |
| ISSN: | 0167-9317 |
| Popis: | This work presents a new type of high-resolution dry-film resist laminates for the fabrication of extremely thick epoxy based polymer structures. Via a lamination process a resist thickness of up to d=360@mm can be applied by one single process step. Afterwards, the dry-film resist is patterned by standard UV-lithography. An epoxy based resist mixture which contains epoxy resins, reactive diluents, additives, and a photo acid generator is deposited onto a PET supporting film by doctor blading for fabrication of the resist film. The films can be cut defect-free into favoured sheet sizes. Currently, dry-film resists with a layer thickness of up to 400@mm can be produced reproducible. With the tested d=360@mm thick dry-film resist an aspect ratio of 15:1 (height:width) has been achieved. By lamination and UV-patterning of two layers resist a master for 700@mm thick electroplated Nickel structures was fabricated. Thereby, steep side walls with an angle deviation of @a |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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