Diamond composites of high thermal conductivity and low dielectric loss tangent
| Autor: | Piotr Klimczyk, I. A. Petrusha, Lucyna Jaworska, Yu. A. Melniychuk, A. S. Osipov, L.O. Romanko, Marcin Podsiadło, Paweł Rutkowski |
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| Rok vydání: | 2021 |
| Předmět: |
010302 applied physics
Materials science Mechanical Engineering Diamond 02 engineering and technology Dielectric Direct bonding Heat sink engineering.material 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Grain size Thermal conductivity Mechanics of Materials Electrical resistivity and conductivity 0103 physical sciences engineering General Materials Science Dielectric loss Composite material 0210 nano-technology |
| Zdroj: | Materials Science and Engineering: B. 269:115171 |
| ISSN: | 0921-5107 |
| DOI: | 10.1016/j.mseb.2021.115171 |
| Popis: | Diamond-CaMg(CO3)2 and diamond-CaCO3 compacts were produced. Maximum values of high thermal conductivity of 540 W/m K, electrical resistivity of 2∙1011 ohm cm, dielectric constant of 47, and dielectric loss tangent of 5.8∙10-3 at 106 Hz were achieved. The composites based on diamonds were sintered at a high pressure of 8.0 GPa and temperature of 2100 °C and were characterised by high ratios of direct bonding between the diamond grains. Diamond grain size varied from 12 to 45 µm. The CaCO3 content of the diamond-CaCO3 composites and the CaMg(CO3)2 content of the diamond-CaMg(CO3)2 composites were 8.5 vol% and 8.8 vol%, respectively. The materials developed are recommended for use as heat sinks in a wide range of electronic devices. |
| Databáze: | OpenAIRE |
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