Autor: |
Abdur Rahman, J.-Y. Yeh, M. Agostinelli, K. Phoa, G. Curello, P. Bai, Joodong Park, Curtis Tsai, Hafez Walid M, C.-H. Jan, K. Komeyli, H. Deshpande, J. Xu |
Rok vydání: |
2011 |
Předmět: |
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Zdroj: |
2011 International Reliability Physics Symposium. |
Popis: |
Extensive reliability characterization of a state of the art 32nm strained HK/MG SoC technology with triple transistor architecture is presented here. BTI, HCI and TDDB degradation modes on the Logic and I/O (1.2V, 1.8V and 3.3V tolerant) transistors are studied and excellent reliability is demonstrated. Importance of process optimizations to integrate robust I/O transistors without degrading performance and reliability of Logic transistors emphasized. Finally, Intrinsic and defect reliability monitoring for HVM are addressed. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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