Thermal joints based on sintered silver micro- and nano- sized particles
| Autor: | Andrzej Moscicki, Tomasz Falat, Jan Felba, W. Macherzyński, Przemyslaw Matkowski, Krzysztof Stojek |
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| Rok vydání: | 2016 |
| Předmět: |
Thermal contact conductance
Materials science business.industry Thermal resistance 020208 electrical & electronic engineering 020206 networking & telecommunications Thermal grease 02 engineering and technology Thermal conduction Thermal bridge Thermal insulation Heat transfer Heat spreader 0202 electrical engineering electronic engineering information engineering Composite material business |
| Zdroj: | 2016 39th International Spring Seminar on Electronics Technology (ISSE). |
| Popis: | Downsizing and increase of working speed of the electronic circuits bring out generating of large amount of heat during operating. The thermal interface materials (TIMs) are one of the best choice to increase the efficiency of heat transfer from the heat source to the heat spreader. Moreover, micro- and nano-sized metallic compounds of thermal interface materials which aim is to increase the thermal conductivity combined with low temperature sintering process allows to create highly conductive (both, thermal and electrical), reliable mechanical joints. Within the paper the results of developing the thermal interface materials will be presented. The thermal resistance, electric parameters and mechanical strength measuring methods, the same as the structures analysis methods will be shown. |
| Databáze: | OpenAIRE |
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