Copper Wire Bond Optimization for Power Devices
| Autor: | R. Manolo, K. Truong, Wentao Qin, A. Denoyo, J. De Clerq, T. Pinili, G. Brizar, B. Yabut, Bill Cowell, J. Jenson, J.P. Gambino, Darren Moore, R. Watkins |
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| Rok vydání: | 2018 |
| Předmět: |
Materials science
Bond 020208 electrical & electronic engineering Copper wire Intermetallic chemistry.chemical_element 02 engineering and technology 021001 nanoscience & nanotechnology Copper Metal chemistry visual_art 0202 electrical engineering electronic engineering information engineering visual_art.visual_art_medium Shear strength Power semiconductor device Composite material 0210 nano-technology Lead (electronics) |
| Zdroj: | 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). |
| DOI: | 10.1109/ipfa.2018.8452561 |
| Popis: | We report on bond pad damage for a smart power device using 50.8 µm (2 mil) diameter Pd-coated Cu wire. We show that the damage can be relatively subtle; the wire bonds on damaged structures have high pull and shear strength, but cracks in the underlying regions lead to metal extrusions that cause electrical shorts. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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