Stress distribution and fractography of soft soldered single and double lap joints

Autor:	Eduardo Carrillo, J. Mora, Brian Mellor, F.J. Molleda, E. Mora, Ma. P. Fonseca, F. Molleda
Rok vydání:	2006
Předmět:	Photoelasticity Lap joint Materials science Shear (geology) Mechanics of Materials Mechanical Engineering Soldering Shear stress General Materials Science Fractography Composite material Stress distribution Condensed Matter Physics
Zdroj:	Materials Characterization. 56:102-106
ISSN:	1044-5803
DOI:	10.1016/j.matchar.2005.07.004
Popis:	The stress distribution and fracture behaviour of soft soldered single and double lap joints have been studied. Stress analysis has been performed using transmission photoelasticity on plastic models. This allowed the shear stress distribution in the joint overlap to be determined. A fractographic study was also carried out on fractured joints made using a Sn–8% Ag soft solder. This analysis allowed the fracture behaviour of this soft solder to be studied under different states of stress (shear and tension).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7a7a4771b9537d066585c2794f48d1f5 https://doi.org/10.1016/j.matchar.2005.07.004 Zobrazit plný text záznamu Full Text from ScienceDirect