Design of multi-finger HBTs with a thermal–electrical model
| Autor: | Chen-Chun Chang-Chiang, Yueh-Cheng Lee, Yang-Hua Chang, Chi-Chung Liu |
|---|---|
| Rok vydání: | 2003 |
| Předmět: |
Engineering
business.industry Heterojunction bipolar transistor Electrical model Bipolar junction transistor Heterojunction Computer Science::Human-Computer Interaction Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials body regions Physics::Fluid Dynamics Thermal Optoelectronics Electrical and Electronic Engineering Safety Risk Reliability and Quality Reduction (mathematics) business Nonlinear Sciences::Pattern Formation and Solitons Common emitter |
| Zdroj: | Microelectronics Reliability. 43:421-426 |
| ISSN: | 0026-2714 |
| Popis: | Multi-finger heterojunction bipolar transistors (HBTs) with uniform spacing exhibit a higher temperature at the center of devices. The temperature distribution on the emitter fingers of the HBT is studied with a three-dimensional thermal–electrical model. Using this model, multi-finger HBTs are designed with non-uniform spacing to improve temperature distribution. Depending on the number of emitter fingers, different design approaches are demonstrated. For a six-finger or 12-finger HBT, the design is more straightforward. For a complex structure such as a 26-finger HBT, an efficient design procedure is necessary. In all of these cases, the calculated results show significant temperature reduction on non-uniform spacing devices. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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