Estimation of Indent Fracture due to the Moving Process of a Pin on PCB Plate

Autor: Choon-Sik Kim, Hee-Sung Lee, Jae-Ung Cho, Young-Choon Kim
Rok vydání: 2014
Předmět:
Zdroj: Journal of the Korea Academia-Industrial cooperation Society. 15:6967-6972
ISSN: 1975-4701
DOI: 10.5762/kais.2014.15.12.6967
Popis: Assembly using a bolt and nut, and rivet or pin have been used widely for forming mechanical joints. The indent method is an easier process than other manufacturing techniques and the toughness of the material is excellent. On the other hand, there are many cases in which the cracks occur on the manufacturing process as the indent method. Therefore, two kinds of models, in which a pin goes into and out PCB plate in this study were developed using the CATIA program and finite element methods were performed using the ANSYS program. When a pin was passed through a PCB plate in cases 1 and 2, the maximum loads applied to the PCB plate were 79.708N and 90.277N, respectively. When the PCB plate came out of the pin in cases 1 and 2, the maximum loads were 63.783N and 33.75N, respectively. The damage prevention and durability can be improved by applying the study results to the design of real indentation.
Databáze: OpenAIRE