Using state-space models for accurate computations of transient thermal behavior of electronic packages

Autor:	Gokul Shankaran, M. Baris Dogruoz, Ryan Magargle
Rok vydání:	2014
Předmět:	Electronic packages Materials science business.industry Computation Thermal Electronic engineering State space Transient (oscillation) Aerospace engineering business
Zdroj:	Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
DOI:	10.1109/itherm.2014.6892389
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::79cdc7769006e409e02db13e706a04ed https://doi.org/10.1109/itherm.2014.6892389 Zobrazit plný text záznamu