| Autor: |
Priscila Brown, Dustin Tenney, Rachel Wynder, Stevan Hunter |
| Rok vydání: |
2016 |
| Předmět: |
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| Zdroj: |
International Symposium on Microelectronics. 2016:000219-000226 |
| ISSN: |
2380-4505 |
| Popis: |
This paper continues the work of reference [1], evaluating shear test results of Cu ball bonds over a variety of probe marks in two different pad aluminum (Al) thicknesses (0.8μm and 3μm). The presence of invasive probe marks on thick Al bond pads lowers certain shear force results.. Lower values of shear force imply reduced Cu bond reliability. Physical factors are investigated relating to poor intermetallic (IMC) formation in the Cu wirebond and bond shear force. Optical microscopic image analysis of Cu bonds, bond contact areas and Al “splash” are studied for correlation with the shear test results. Percent IMC coverage of bond contact areas decrease when invasive probe marks are present beneath the bond, which in turn may reduce the shear force. Probe mark features are studied to discover the characteristics of greatest influence on % IMC coverage and shear test values in each of the pad metal thicknesses. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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