Reliability Lifetime Prediction of SiC IGBT Devices with Different Packaging Approaches

Autor:	Hui Li, Siyu Chen, Ran Yao, Bailing Zhou, Wei Lai, Jinyuan Li, Zhongyuan Chen, Yaosheng Li
Rok vydání:	2023
Zdroj:	Lecture Notes in Electrical Engineering ISBN: 9789819904075
DOI:	10.1007/978-981-99-0408-2_36
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::797e3aa2646dc73b97f59346b02c22d8 https://doi.org/10.1007/978-981-99-0408-2_36 Zobrazit plný text záznamu