| Autor: |
A.J. Pang, M. Leonard, R.W. Barber, Robert Lewis Reuben, R.S. Dhariwal, F. Waldron, Marta Rencz, Marc P.Y. Desmulliez, O. Slattery, Keith R. Pullen, Andrew S. Holmes, D.R. Emerson, Guodong Hong |
| Rok vydání: |
2005 |
| Předmět: |
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| Zdroj: |
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971). |
| DOI: |
10.1109/eptc.2004.1396671 |
| Popis: |
The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The device is to be used in microelectronic packaging cooling applications. The nickel-based micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from the UV-LIGA (UV-lithography, electroforming, replication) process. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate has been tested using a custom-made rig to measure the flow pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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