Novel polyethersulfone dielectric films with high temperature resistance, intrinsic low dielectric constant and low dielectric loss
| Autor: | Jingyue Liu, Zejun Pu, Xiaohang He, Jialing Xia, Jiachun Zhong, Qi Wang, Xueyu Liu |
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| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
chemistry.chemical_classification Materials science Dielectric Polymer Condensed Matter Physics 01 natural sciences Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials Amorphous solid Chemical engineering chemistry 0103 physical sciences Ultimate tensile strength Copolymer Dissipation factor Dielectric loss Electrical and Electronic Engineering Glass transition |
| Zdroj: | Journal of Materials Science: Materials in Electronics. 32:967-976 |
| ISSN: | 1573-482X 0957-4522 |
| Popis: | In this work, a series of fluorene-containing fluorinated polyethersulfone (PES-6AF/BHPF) copolymers with high temperature resistance and intrinsic low dielectric constant (low-e) have been designed and synthesized from 4,4′-dichlorophenyl sulfone (DCS) and polyphenol. The performance of obtained PES-6AF/BHPF can be controlled and optimized by controlling the copolymers structure. The thermal and dielectric properties of PES-6AF/BHPF were evaluated comprehensively. The obtained PES-6AF/BHPF copolymers show high glass transition temperatures (Tg) ranging from 200 to 260 °C, and 5% weight loss temperatures (Td5%) is stable up to 500 °C. The e value of PES-6AF/BHPF-0% and PES-6AF/BHPF-100% are as low as 2.1 and 2.3, and the loss tangent (tan δ) are only 0.0088 and 0.003 at 1 kHz, respectively. In addition, all of PES-6AF/BHPF films show good stability of dielectric properties in high temperature conditions. More importantly, the PES-6AF/BHPF copolymers are soluble in common solvents (such as DMAc, NMP, DMF, THF). The PES-6AF/BHPF copolymers are amorphous and can be easily cast into transparent and flexible films with tensile strength of 62–74 MPa and an elongation at break of 13.3–15.8%. The outstanding comprehensive properties made it possible to be the most promising polymer candidates for high-performance interlayer dielectrics. |
| Databáze: | OpenAIRE |
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