| Autor: |
Ravi Prasher, Abhay A. Watwe |
| Rok vydání: |
2001 |
| Předmět: |
|
| Zdroj: |
Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques. |
| DOI: |
10.1115/imece2001/htd-24385 |
| Popis: |
Traditional methods of estimating package thermal performance employ numerical modeling using commercially available finite-volume or finite-element tools. Use of these tools requires training and experience in thermal modeling. This methodology restricts the ability of die designers to quickly evaluate the thermal impact of their die architecture due to the added throughput time required to enlist the services of a thermal analyst. This paper describes the development of an easy to use spreadsheet tool, which performs quick-turn numerical evaluations of the impact of non-uniform die heating. The tool employs well-established finite-volume numerical techniques to solve the steady-state, three-dimensional Fourier equation of conduction in the package geometry. Minimal input data is required and the inputs are customized using visual basic pull-down menus to assist die designers who may not be thermal experts. Data showing comparison of the estimates from the spreadsheet tool with that obtained from a conventional analysis using the commercially available finite element code ANSYS™ is also presented. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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