High-speed Data Center PCB Design Challenges and Findings by Intel ® Automatic In-board Characterization

Autor:	Jimmy Hsu, Gary Hung, Jim Tseng, Brian Ho, Lemon Lin, Thonas Su
Rok vydání:	2022
Zdroj:	2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::78cd2700e4666bf921760e417406b689 https://doi.org/10.1109/impact56280.2022.9966724 Zobrazit plný text záznamu