Development of close-to-zero damage rear heterojunction stripe contacts and compatible front metallization approaches for hybrid heterojunction solar cells
| Autor: | Mei Huang, Puqun Wang, Ranjani Sridharan, Jaffar Moideen Yacob Ali, Rolf Stangl, Mengjie Li, Ankit Khanna |
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| Rok vydání: | 2018 |
| Předmět: |
Laser ablation
Materials science Passivation Open-circuit voltage business.industry Heterojunction 02 engineering and technology 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences 0104 chemical sciences Saturation current Plating Screen printing Optoelectronics 0210 nano-technology Electroplating business |
| Zdroj: | 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion (WCPEC) (A Joint Conference of 45th IEEE PVSC, 28th PVSEC & 34th EU PVSEC). |
| DOI: | 10.1109/pvsc.2018.8547265 |
| Popis: | A close-to-zero damage rear-side heterojunction stripe contact has been realized using laser ablation, which involves the optimization of (1) laser fluence and (2) wet-chemical damage removal processes. The saturation current density (j 0 ) values underneath the heterojunction stripe contacts as well as underneath the passivated regions have been extracted using intensity-dependent photoluminescence (PL) imaging and PL image analysis using Griddler AI. Thus the area-fraction and pitch of rear-side heterojunction stripe-contacts can be optimized by means of numerical computer simulation. The measured implied open circuit voltages and extracted saturation current densities of the heterojunction stripe-contacts (j 0,cont ≈ 20 fA cm−2) show that close-to-zero damage rear-side heterojunction stripe contacts can be realized under optimized conditions. For the front-side metallization scheme, a low-temperature metallization approach, i.e. light-induced plating thickened by electroplating, is investigated to avoid degradation of the heterojunction layers by conventional high-temperature screen printing. It’s demonstrated that plating can achieve comparable efficiencies with respect to conventional screen printing and can be applied directly to hybrid heterojunction solar cells using a rear-emitter configuration. For front-emitter configurations, a thin evaporated metal contact layer may be used as the seed layer for subsequent electroplating. |
| Databáze: | OpenAIRE |
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