Reaction Diffusion Characteristics at Interface of Copper/Aluminium Friction Weld
Autor: | Yoshiyasu Itoh, Masaru Tezuka, Masahiro Saitoh, Takahiko Shindoh |
---|---|
Rok vydání: | 1998 |
Předmět: | |
Zdroj: | TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 64:494-499 |
ISSN: | 1884-8338 0387-5008 |
Popis: | The friction welding for copper and aluminium is useful to minimize the diffusion thickness at the interface between copper and aluminium. The minimization of diffusion thickness is required for maintaining the joint strength. Because brittle intermetallic compounds are formed at the weld interface between copper and aluminium. These reaction diffusion behaviors at the interface between copper and aluminium, which have an important effect on weld joint degradation, have not fully been clarified. And, it is needed to evaluate the growth of intermetallic compounds for optimizing the joint strength. The experimental results showed that the reaction diffusion layers consisted of CuAl2, CuAl and Cu9Al4. It is also confirmed that the each diffusion thickness can be observed the parabolic time dependence and Arrhenius type temperature dependence. And the order of reaction diffusion rate was CuAl2>CuAl>Cu9Al4. A computer-aided interactive system has been developed, which enables to conveniently analyze the reaction diffusion behaviors and some problems were analyzed. |
Databáze: | OpenAIRE |
Externí odkaz: |