Autor: |
Keisuke Ohdaira, Seira Yamaguchi, Naoyuki Nishikawa |
Rok vydání: |
2017 |
Předmět: |
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Zdroj: |
2017 IEEE 44th Photovoltaic Specialist Conference (PVSC). |
DOI: |
10.1109/pvsc.2017.8366664 |
Popis: |
We directly observed the potential-induced degradation (PID) of a silicon nitride (SiNx)/crystalline Si (c-Si) interface by measuring the effective minority carrier lifetime (Teff) of c-Si wafers laminated in a module-like structure. We observed slow Teff reduction during a negative-bias PID stress and a rapid drop of Teff by positive-bias application. The former may correspond to the introduction of Na to stacking faults on cSi, while the latter is probably related to negative charge accumulation in the SiNx. These behaviors well reproduce the characteristics of PID for n-type rear-emitter (RE) photovoltaic (PV) modules. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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