| Popis: |
In many modern information systems, the heat generated during the operation of electronic devices is usually dissipated by heat-conductive pads between the casing of the respective equipment and a massive base (platform). For newly developed pads, the promising materials are composites on the basis of various types of silicone rubber. At the same time, during the production of the pads without a vacuum setup, the material can contain air bubbles, which causes the porosity potentially negative for the thermal properties of the material. This work studies the thermal conductivity depending on the degree of silicone matrix filling by copper particles, introduced to improve thermal conductivity, and by air bubbles that are considered as reinforcing inclusions. |
