| Autor: |
K. Ishibashi, T. Sakai, T. Maeda, S. Sakemi |
| Rok vydání: |
2006 |
| Předmět: |
|
| Zdroj: |
2006 International Conference on Electronic Materials and Packaging. |
| DOI: |
10.1109/emap.2006.4430659 |
| Popis: |
PoP technology is emerging as an alternative solution to SiP since it has advantage of easier testing and sourcing. ? Flux-dipping PoP has risk of cold open joints due to package reflow warpage. Controlling warpage is challenging especially when top/bottom package come from different suppliers. ? New SMT paste STAMP was developed to enlarge process window of PoP stacking. The paste consists of higher m.p. metal flakes uniformly dispersed in flux, which is effective to fill ball-pad gap. ? SMT trial showed better PoP stacking yield of STAMP. Also, BLR of STAMP-build PoP was as good as flux-build PoP. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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