Thermal Simulation into the Effect of Varying Encapsulant Media on Wire Bond Stress Under Temperature Cycling

Autor:	Paul Mumby-Croft, Xiaoping Dai, Matt Packwood, Daohui Li
Rok vydání:	2018
Předmět:	Wire bonding Materials science business.product_category chemistry.chemical_element Temperature cycling Insulated-gate bipolar transistor Wedge (mechanical device) chemistry Aluminium Power electronics Thermal Composite material business Failure mode and effects analysis
Zdroj:	2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Popis:	Mechanical failures of wedge bonded aluminium wire interconnects are identified as a failure mode in power electronics modules and these wirebonds are often encapsulated in a variety of insulating media to improve electrical isolation and lifetime. Thermal/mechanical simulations have identified the effects of these encapsulating media on the stress induced during thermal load application and have shown that the choice of encapsulating media, as well as method of application, greatly affect the stress induced under thermal load.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::76a317f99433bfa5e32880f3c8d0557a https://doi.org/10.1109/icept.2018.8480816 Zobrazit plný text záznamu