Evolutionary Design of Novel Coolant Passages for Cooling a Square Substrate by Single Stream
| Autor: | Ajit K. Sahoo, Ashok K. Barik, Prafulla Kumar Swain |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
010302 applied physics
Pressure drop Materials science 020209 energy Mechanical Engineering 02 engineering and technology Substrate (printing) Condensed Matter Physics 01 natural sciences Square (algebra) Coolant Mechanics of Materials 0103 physical sciences 0202 electrical engineering electronic engineering information engineering General Materials Science Composite material |
| Zdroj: | Journal of Heat Transfer. 143 |
| ISSN: | 1528-8943 0022-1481 |
| DOI: | 10.1115/1.4051464 |
| Popis: | Different designs of novel coolant (i.e., water) circuits have been proposed using a well-established constructal law to cool a square substrate made up of aluminum oxide and subjected to a uniform wall heat flux (i.e., q″=200 W/m2) at its top. Five different flow-path topologies: case-1 (umbrella-shaped), case-2 (dumbbell-shaped), case-3 (hexagonal-shaped), case-4 (down-arrow-shaped), and case-5 (up-arrow-shaped) are evolved from a single pipe embedded in the heated substrate. The best cooling pathway has been anticipated by comparing the thermo-fluid characteristics of all the designs. A numerical route, via ansys R 16, has been implemented to solve the transport equations for continuity, momentum, and energy along with relevant boundary conditions. To access a better design, the nondimensional temperature and pressure drop for these cases have been quantified and compared, by varying the length and Reynolds number in the range of 2≤Lc/L≤3 and 100≤Re≤2000, respectively. We observe a decrease in the temperature and an increase in the pressure drop with Reynolds number for all the considered pathways. When Re≤500, a rapid fall in the nondimensional temperature has been noticed; and thereafter, it looks like a plateau for all cases. For case-4, a minimum temperature is obtained at the nondimensional pipe length of 2.5. At Lc/L≤2.5, we observe that the case-4 provides better cooling to the substrate among all other designs. Also, the pressure drop for case-4 is not too high as compared to other designs. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|