Non-destructive Thermal Diagnostics of Multilayer Substrates for Multichip Modules

Autor:	Anna Stoynova, Borislav Bonev, Svetozar Andreev, Nina Spasova
Rok vydání:	2021
Zdroj:	2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
DOI:	10.1109/eptc53413.2021.9663919
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::75e905622f3dd068380e200c49901d3f https://doi.org/10.1109/eptc53413.2021.9663919 Zobrazit plný text záznamu